Recent reports indicate that Samsung Electronics is preparing to commence shipments of the latest generation of HBM chips to Nvidia and AMD. This shipment could arrive as early as February 2026, jumping ahead of Samsung’s rivals in a bid to boost its global AI market share.
Mass production of the sixth-generation, 12-layer HBM4 chip is scheduled for February, with shipments going to customers soon after. Samsung recently cleared final qualification tests done by Nvidia and AMD, after sending samples in September, various local media reported.
The Korean Economic Daily reported shipping ahead of SK Hynix and Micron Technology would mark a huge turnaround for Samsung, which in October 2025 issued an apology for delays in shipping new memory chips to support AI applications. At the time, the head of its chip unit vowed to reorganise the division.
It only secured approval from Nvidia for the previous generation, the HBM3E, in September 2025, with rival SK Hynix and Micro Technology gaining approval in early 2025.
SK Hynix completed development of the MBN4 chip in September, after shipping samples of its to customers in March, ahead of Samsung and Micron.
Counterpoint Research showed SK Hynix led the HBM market in Q3 with a 57 per cent share. Samsung and Micron trailed with 22 per cent and 21 per cent shares, respectively.
Source: Mobile World Live
Image Credit: Stock Image
