Sony’s semiconductor arm recently agreed a preliminary strategic partnership with TSMC to develop and manufacture the next-generation of image sensors.
Additional elements of this agreement include jointly exploring physical AI applications in areas including automotive and robotics.
Sony Semiconductor Solutions stated it had signed a non-binding memorandum of understanding (MoU) with the Taiwan-based company, which could lead to the establishing of a joint venture (JV), of which Sony will be the majority and controlling shareholder.
Both companies are currently discussing their respective potential investments in the JV, which are “being considered on the premise that they would be implemented in phases based on market demand”. There is also an expectation for additional support from the Japanese government.
Forming the JV is subject to reaching a definitive legally binding agreement and other customary closing conditions.
Pave the way
Sony will set up development and production lines at its newly constructed fabrication plant in Koshi City, Japan. Through the JV, Sony will use its expertise in sensor design, combining with TSMC’s strengths in process technology and manufacturing, with the aim of enhancing image sensor performance.
Details on potential work around automotive and robotics was sparse, but should the JV be completed, the companies said the two fields will pave “the way for future innovations and expanded technological advancements”.
Shinji Sashida, President and CEO of Sony’s semiconductor business, said the proposed deal expands a long-standing collaboration between the pair, which will “advance our partnership to a new stage”.
Source: Mobile World Live
Image Credit: Sony & TSMC
